| 摘要 |
PURPOSE: A plating device is provided to evenly distribute plating chemical on a substrate by providing fine vibration to the substrate during plating. CONSTITUTION: A plating device comprises a plating rack(2) in which a substrate(Y) is fixed, a transfer rail unit(4) which holds and transfers the plating rack with a rail(A) and a transfer device(B), a chemical plating unit(6) which plates the substrate on the plating rack with chemical within the transfer section of the rail of the transfer rail unit, and a vibration generating unit(8) which provides vibration to the plating rack arranged on the rail.
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