OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

摘要

An optical semiconductor package, a method for manufacturing the optical semiconductor package, and an optical semiconductor device of the present invention are capable of suppressing deterioration of a resin and capable of suppressing deterioration of reflectance using a thermosetting resin, such as an unsaturated polyester, as a material of a reflector (5) or as a resin (6) that is exposed at the periphery of the optical semiconductor element.