| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain an electrically uniform and favorable joint that maintains constant a gap between a rectangular electric conductive wire part and a joining object of the wire part, that is, the thickness of a surface layer, and to suppress the occurrence of warpage and cracks in the joining object by reducing a thermal stress and a thermal strain generating after mounting the wire part by soldering, which is caused by the difference in thermal expansion between a material of the electric conductive wire part and a material of the joining object. <P>SOLUTION: A rectangular conductive wire to be used for an interconnector or the like id provided, comprising a copper wire part 1 and a surface layer 2 that covers at least one wide face of the copper wire part 1, particularly the whole surface in this embodiment, with solder plating 2a. The surface layer 2 includes a granular filler 2b comprising a material having a higher melting point than that of the solder, the filler dispersed in the solder plating 2a. <P>COPYRIGHT: (C)2013,JPO&INPIT |
