| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip-like electronic component which suppresses deterioration in reliability and is suitable for miniaturization. <P>SOLUTION: A chip-like electronic component 1 comprises a component body 10 which has an internal electrode 11 embedded therein and is made of ceramics, and an external electrode 20 formed on an outer surface of the component body 10. The external electrode 20 comprises: a first electrode layer 21 formed on the outer surface of the component body; a protective layer 22 which is formed on an outer surface of the first electrode layer 21 by a physical vapor deposition method or a chemical vapor deposition method and prevents diffusion of hydrogen into the component body 10; and one or more second electrode layers 23 and 24 which are formed on an outer surface of the protective layer 22 by electrolytic plating. <P>COPYRIGHT: (C)2013,JPO&INPIT |
