发明名称
摘要 To provide a thin multilayer flexible circuit board having cable portions drawn out of a plurality of outer layers, and a method for manufacturing the same. A multilayer flexible circuit board including a parts mounting portion having an inner-layer board 107 and outer-layer boards 106, and cable portions drawn out of at least one of the inner-layer board and outer-layer boards, wherein each of the inner-layer board and the outer-layer boards has circuits facing one another, characterized by each of the circuits facing one another is covered with a cover 5 formed of a cover film in common with the cable portion: and a method for manufacturing the same.
申请公布号 JP5095117(B2) 申请公布日期 2012.12.12
申请号 JP20060109776 申请日期 2006.04.12
申请人 发明人
分类号 H05K3/46;H05K3/28 主分类号 H05K3/46
代理机构 代理人
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