发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which prevents discharge of charge from a charge storage element after manufacturing of the semiconductor device to reduce charge damage of a device function element. <P>SOLUTION: A semiconductor device comprises: a device function element formed on a semiconductor substrate; a charge storage element formed on the semiconductor substrate; and an isolation element formed on the semiconductor substrate, and connected between the device function element and the charge storage element, and formed from an electrically rewritable and nonvolatile memory transistor. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012244046(A) 申请公布日期 2012.12.10
申请号 JP20110114672 申请日期 2011.05.23
申请人 FUJITSU SEMICONDUCTOR LTD 发明人 NISHIMURA TETSUKAZU
分类号 H01L21/822;H01L21/3205;H01L21/336;H01L21/768;H01L21/82;H01L21/8234;H01L21/8247;H01L23/522;H01L27/04;H01L27/06;H01L27/10;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/822
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