| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device module suitable for mounting an electronic component on a panel by utilizing a transparent conductive film. <P>SOLUTION: The electronic device module comprises a first substrate having a first wiring layer and a first alignment mark exhibiting transparency in a visible region, and a second substrate provided to face a part of the first substrate and having a second wiring layer and a second alignment mark disposed to face the first alignment mark. When mounting the second substrate having the second wiring layer on the first substrate having the first wiring layer, they are aligned by utilizing the first alignment mark exhibiting transparency and the second alignment mark. <P>COPYRIGHT: (C)2013,JPO&INPIT |
