| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a backing plate capable of solving a problem of insufficient cooling without bonding whole surface of a target material with indium, a target device, and a sputtering apparatus. <P>SOLUTION: A cover plate part 23 is stuck and fixed in a ring shape on one surface of a body 21 of the backing plate, and a cooling medium is fed into a groove 24 formed therein from the external. The cooling medium contacts with a back surface of the cover plate part 23, and cools a target material 22 retained on a front surface of the cover plate part 23. Elastic members 26 deformed by compression are disposed in the body 21, so that expansion force is applied on the back surface of the cover plate part 23 in a direction from the back surface side to the front surface side. Since the cover plate part 23 expands by the expansion force following to a warpage of the target material 22 when the warpage occurs in the target material 22 by collision of ions in plasma, the cover plate part 23 and the target material 22 are kept in contact at a wide area, so that the cooling efficiency does not decrease. <P>COPYRIGHT: (C)2013,JPO&INPIT |
