| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device which prevents defects from occurring in elements and a manufacturing method of the electronic device. <P>SOLUTION: An electronic device is formed by forming elements (20, 60) and a through electrode (30) in joined two substrates (10, 50). The elements (20, 60) are formed in at least one of the two substrates (10, 50), and the through electrode (30) is formed in at least one of the two substrates (10, 50). The through electrode (30) includes: trenches (31) formed by removing a part of the one substrate (10) from the side of a joined surface (10a) on the one substrate (10), which is joined to the other substrate (50), to a rear surface (10b); and conductive films (35) formed on a part of a wall surface forming the trench (31). <P>COPYRIGHT: (C)2013,JPO&INPIT |
