| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide soldering method and device of an electronic component which materialize high quality soldering by performing non-contact local heating of the soldering region of a printed board, by induction heating for a local soldering area, thereby ensuring temperature uniformity in the heating region. <P>SOLUTION: An outer coil 1 is disposed on the outside of a cylindrical outer ferrite core 2, and an inner coil 3 and an inner ferrite core 4 are disposed on the inside of the outer ferrite core 2. The heating region 7 of a heated body is then heated up to the fusion temperature of solder by applying a high frequency current to the outer coil and inner coil thus ensuring in-plane temperature uniformity of the heating region. <P>COPYRIGHT: (C)2013,JPO&INPIT |
