发明名称 METHOD FOR PRODUCING MULTI-LAYER SUBSTRATE AND MULTI-LAYER SUBSTRATE
摘要 Provided are: a method that is for producing a highly reliable multi-layer substrate and that, when producing a multi-layer substrate provided with a resin layer on both primary surface sides, can suppress the occurrence of warping in the resin layer curing step; and a highly reliable multi-layer substrate without warping. A mounting-completed core parent substrate is formed to which surface-mounted components (2a, 2b) have been mounted to both primary surface sides of a core parent substrate (10) containing a plurality of core individual substrates and to which a through hole (7) that penetrates each core individual substrate has been formed. In a manner so that resin layers (11, 12) on both primary surface sides that each core individual substrate (1) obtained by splitting the core parent substrate (10) is provided with are in the state of being joined to each other and integrated at a predetermined region (P), a partially-cured resin layer is formed at both primary surfaces of the core parent substrate, the resin layers of both primary surface sides are joined to each other via the through hole (7), the resin layer is subjected to main curing, and then the core parent substrate is split at a predetermined position to separate the core parent substrate into core individual substrates (1).
申请公布号 WO2012165530(A1) 申请公布日期 2012.12.06
申请号 WO2012JP64044 申请日期 2012.05.31
申请人 MURATA MANUFACTURING CO.,LTD.;OTSUBO, YOSHIHITO 发明人 OTSUBO, YOSHIHITO
分类号 H05K3/46;H01L25/10;H01L25/18;H05K1/02;H05K3/28 主分类号 H05K3/46
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