| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing device chips in which an arrangement device wafer is not damaged during handling and that eliminates the need of using a support plate or an adhesive material. <P>SOLUTION: A method of manufacturing device chips sealed with a sealing agent 32 comprises the steps of: selecting only non-defective device chips from a wafer cut along a plurality of predetermined division lines crossing each other and rearranging them in each device arrangement region; forming an arrangement device wafer 34 by sealing rear surface sides of the device chips with the sealing agent; forming an annular convex 86 surrounding a device chip existence region on a rear surface of the arrangement device wafer by shaving the rear surface of the arrangement device wafer corresponding to a region in which the device chips of the arrangement device wafer exist to form a circular recess 84; and dividing the arrangement device wafer along the predetermined division lines to form the plurality of device chips sealed with the sealing agent. <P>COPYRIGHT: (C)2013,JPO&INPIT |
