发明名称 |
Semiconductor Device and Method of Forming EWLB Semiconductor Package with Vertical Interconnect Structure and Cavity Region |
摘要 |
A semiconductor device has a substrate containing a transparent or translucent material. A spacer is mounted to the substrate. A first semiconductor die has an active region and first conductive vias electrically connected to the active region. The active region can include a sensor responsive to light received through the substrate. The first die is mounted to the spacer with the active region positioned over an opening in the spacer and oriented toward the substrate. An encapsulant is deposited over the first die and substrate. An interconnect structure is formed over the encapsulant and first die. The interconnect structure is electrically connected through the first conductive vias to the active region. A second semiconductor die having second conductive vias can be mounted to the first die with the first conductive vias electrically connected to the second conductive vias. |
申请公布号 |
US2012306038(A1) |
申请公布日期 |
2012.12.06 |
申请号 |
US201113149628 |
申请日期 |
2011.05.31 |
申请人 |
CHOW SENG GUAN;LIM LEE SUN;HUANG RUI;BAO XUSHENG;HLAING MA PHOO PWINT;STATS CHIPPAC, LTD. |
发明人 |
CHOW SENG GUAN;LIM LEE SUN;HUANG RUI;BAO XUSHENG;HLAING MA PHOO PWINT |
分类号 |
H01L31/0203;H01L31/18 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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