发明名称 INPUT DEVICE MANUFACTURING PROCESS
摘要 <p>For the manufacturing of an input device, a sensor assembly (10) comprising a film-type pressure sensor (12) and a cover layer (14) is provided. The pressure sensor includes a first carrier film (18) applied against the cover layer, a second carrier film (20) and a spacer (22) attaching the first and second carrier films to each other. In an opening in the spacer, a first (24) and a second (26) electrode are arranged on the first and the second carrier film, respectively. The electrodes are arranged facing each other so that they may be brought closer together when the pressure sensor is compressed. The sensor assembly is arranged in a mould (32), so that the cover layer lies against a wall thereof. Plastic material (34) is then injected into the mould while a removable insert (30) arranged within the opening prevents the second carrier film from collapsing onto the first carrier film as the plastic material is injected.</p>
申请公布号 WO2012163691(A1) 申请公布日期 2012.12.06
申请号 WO2012EP59240 申请日期 2012.05.18
申请人 IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A.;NOLL, ALAIN 发明人 NOLL, ALAIN
分类号 H01H13/88;B29C45/00;B29C45/14 主分类号 H01H13/88
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