FORMING FUNCTIONALIZED CARRIER STRUCTURES WITH CORELESS PACKAGES
摘要
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, wherein the carrier material comprises a top layer and a bottom layer separated by an etch stop layer; forming a dielectric material adjacent the die, forming a coreless substrate by building up layers on the dielectric material, and then removing the top layer carrier material and etch stop layer from the bottom layer carrier material.
申请公布号
SG183881(A1)
申请公布日期
2012.11.29
申请号
SG20120065199
申请日期
2011.04.15
申请人
INTEL CORPORATION
发明人
NALLA, RAVI, K.;AZIMI, HAMID, R.;GUZEK, JOHN, S.;GONZALEZ, JAVIER SOTO;DELANEY, DREW, W.