发明名称 |
METHOD OF BONDING A METAL TO A SUBSTRATE |
摘要 |
A method of bonding a metal to a substrate is disclosed herein. The method involves forming a nano-brush on a surface of the substrate, where the nano-brush includes a plurality of nano-wires extending above the substrate surface. In a molten state, the metal is introduced onto the substrate surface, and the metal surrounds the nano-wires. Upon cooling, the metal surrounding the nano-wires solidifies, and during the solidifying, at least a mechanical interlock is formed between the metal and the substrate.
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申请公布号 |
US2012301743(A1) |
申请公布日期 |
2012.11.29 |
申请号 |
US201113310135 |
申请日期 |
2011.12.02 |
申请人 |
WALKER MICHAEL J.;POWELL, JR. BOB R.;GM GLOBAL TECHNOLOGY OPERATIONS LLC |
发明人 |
WALKER MICHAEL J.;POWELL, JR. BOB R. |
分类号 |
B32B7/04;B05D3/00;B05D5/00;B82Y30/00;B82Y40/00;C23C16/44;C23F1/02 |
主分类号 |
B32B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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