发明名称 POLYAMIC ACID AND NON-THERMOPLASTIC POLYIMIDE RESIN
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyimide resin which can be processed into a flexible metal clad laminate excellent in high-temperature processability, having preferable adhesion between a polyimide layer and a metal layer and also having preferable adhesion between a polyimide layer and a resist. <P>SOLUTION: A polyamic acid is provided by polymerizing (A) at least one kind of biphenyl tetracarboxylic acid dianhydride selected from among 3, 4, 3', 4'-biphenyl tetracarboxylic dianhydride, 2, 3, 3', 4'-biphenyl tetracarboxylic acid dianhydride and 2, 3, 2', 3'-biphenyl tetracarboxylic acid dianhydride, (B) at least one kind of straight-chain acid dianhydride selected from among pyromellitic acid dianhydride, 2, 3, 6, 7-naphthalenetetracarboxylic acid dianhydride and 1, 4, 5, 8-naphthalenetetracarboxylic acid dianhydride, (C) 2, 2'-dimethyl-4, 4'-diaminobiphenyl and/or p-phenylene diamine and (D) at least one kind of diamine component selected from 1, 3-bis(3-aminophenoxy)benzene, 1, 3-bis(4-aminophenoxy) benzene, 3, 3'-diaminodiphenylether and 3, 4'-diaminodiphenylether. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012233198(A) 申请公布日期 2012.11.29
申请号 JP20120170525 申请日期 2012.07.31
申请人 ARISAWA MFG CO LTD 发明人 MATSUYAMA HIROYUKI;FUJITA SHUICHI
分类号 C08G73/10;B32B15/088;H05K1/03 主分类号 C08G73/10
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