| 摘要 |
PURPOSE: A wafer defect high speed inspection apparatus is provided to improve detection resolving power by obtain high-definition image at high speed. CONSTITUTION: A first measuring unit(110) detects a height of wafer. The first measuring unit obtains information of the height of the detected wafer. A second measuring unit(120) obtain an image of the wafer. Information of the height of the obtained wafer is provided to the second measuring unit. An image of the wafer is focused by using the information of the height. [Reference numerals] (210) Height information storage; (220) Height information calculation unit(average); (310) Stage driving unit
|
