摘要 |
PURPOSE: A substrate chamfering device and a method thereof are provided to uniformly chamber a substrate even though an error exists in alignment of the substrate and the substrate has curves such as edge lines. CONSTITUTION: A substrate is aligned using a pre-align unit(30). An edge line of the substrate is inspected in real time using a first vision unit(50). A location of a chamfering unit(40) is aligned in real time according to edge line information of the substrate. Both edges of the substrate are chamfered by a set chamfering degree. The chamfering degree of the substrate is inspected using a second vision unit(60). |