发明名称 CONTROL METHOD OF SUBSTRATE WARPAGE BY CONTROLLING PHYSICAL PROPERTIES AND SUBSTRATE APPLIED BY THE SAME
摘要 PURPOSE: A method for controlling the warpage of a substrate by a physical control is provided to easily control the warpage of the substrate using a physical design of a core layer even though the substrate is thin. CONSTITUTION: A core layer(130) includes insulation resin and a glass fiber layer. A copper foil(120) is laminated on one side of the core layer. When a concave or convex warpage of the substrate is generated by measuring the warpage of the substrate in one direction, a physical property is controlled in the other direction of the core layer to generate the warpage of the substrate in the other direction.
申请公布号 KR20120129096(A) 申请公布日期 2012.11.28
申请号 KR20110047148 申请日期 2011.05.19
申请人 发明人
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
代理机构 代理人
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