发明名称 Light emitting package and method for manufacturing the same
摘要 PURPOSE: A light emitting package and a manufacturing method thereof are provided to improve brightness without an increase in power consumption by forming a protective layer to partially cover a reflective layer of a lead frame and preventing discoloration of the reflective layer. CONSTITUTION: A lead frame(10) comprises a first lead(11) and a second lead(13) which are separated from each other. A light emitting device(20) is mounted on a mounting portion of the lead frame. A molding material(50) forms an overall outer shape while being combined with the lead frame. A bonding wire(30) electrically connects the light emitting device and the lead frame. A protective layer(15) is arranged on the reflective layer in an exposed portion to the outside of the molding material of the lead frame.
申请公布号 KR20120127995(A) 申请公布日期 2012.11.26
申请号 KR20110045849 申请日期 2011.05.16
申请人 发明人
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
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