发明名称 SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To reduce a leakage current between a pixel part and electrodes. <P>SOLUTION: A solid-state imaging apparatus 1 includes: a semiconductor layer 13 having a first region and a second region; a pixel part provided in the first region; a plurality of electrodes 22 which are provided in the second region and penetrate the semiconductor layer 13; and a guard ring 20 which is provided in the second region, penetrates the semiconductor layer 13, and electrically isolates the pixel part from the plurality of electrodes 22. An upper surface of the semiconductor layer 13 in the second region is lower than an upper surface of the semiconductor layer 13 in the first region. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012231027(A) 申请公布日期 2012.11.22
申请号 JP20110098534 申请日期 2011.04.26
申请人 TOSHIBA CORP 发明人 KOIKE HIDETOSHI
分类号 H01L27/146;H01L21/02;H01L27/12;H01L27/14 主分类号 H01L27/146
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