| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component module which easily transmits heat generated in an electronic component to a rear surface of a printed board and enhances the heat radiation effect on the rear surface of the printed board, and to provide a manufacturing method of the electronic component module. <P>SOLUTION: In an electronic component module of this invention, a conductive thin film 12 is formed on a surface of an insulation substrate 11 to form a printed board 10, electronic components 40 are mounted on a surface of the printed board 10, and the electronic components 40 are electrically connected with the printed board 10 through the conductive thin film 12. The printed board 10 is formed so as to have the thickness which does not have self-standing ability on its own, and a heat radiation member 20 is mounted on a rear surface of the insulation substrate 11. The deflection of the printed board 10 is prevented by the heat radiation member 20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
