FLUX FOR SOLDER PASTE, AND SOLDER PASTE

摘要

A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.