发明名称 |
Substrate structure for an image sensor package and method for manufacturing the same |
摘要 |
A substrate structure for an image sensor package includes a bottom base and a frame layer. The bottom base has an upper surface formed with a plurality of first electrodes, and a lower surface formed with a plurality of second electrodes. An insulation layer is coated between the first electrodes and in direct surface contact with the upper surface of the bottom base. A frame layer is arranged on and in direct surface contact with the first electrodes and the insulation layer to form a cavity together with the bottom base. The insulation layer is interposed between the bottom base and the frame layer. |
申请公布号 |
US8314481(B2) |
申请公布日期 |
2012.11.20 |
申请号 |
US20050131727 |
申请日期 |
2005.05.18 |
申请人 |
HSIN CHUNG HSIEN;HUANG YVES;CHANG KEVIN;LIN CHIEF;KINGPAK TECHNOLOGY INC. |
发明人 |
HSIN CHUNG HSIEN;HUANG YVES;CHANG KEVIN;LIN CHIEF |
分类号 |
H01L23/06 |
主分类号 |
H01L23/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|