| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si based alloy and a Cu-Co-Si based alloy in which the balance between 0.2% proof stress, bendability, the fatigue strength in a high cycle is improved. <P>SOLUTION: The copper alloy for an electronic material includes: 1.0-4.5 mass% of the total of one or two selected from Ni and Co; 0.2 to 1.3 mass% of Si, wherein (Ni+Co)/Si (mass ratio)=3.0 to 5.5; and a balance consisting of copper and inevitable impurities, wherein βä220} being the half value width of an X-ray diffraction intensity peak from the ä220} crystal plane of a rolling surface with β<SB POS="POST">O</SB>ä220} being the half value width of an X-ray diffraction intensity peak from the ä220} crystal plane of a pure copper standard powder satisfy the following formula: 1.5≤βä220}/β<SB POS="POST">O</SB>ä220}≤3, and a work hardening coefficient (n value) is less than 0.04. <P>COPYRIGHT: (C)2013,JPO&INPIT |
