SUBSTRATE PROCESSING METHOD, PROGRAM, COMPUTER STORAGE MEDIUM, SUBSTRATE PROCESSING APPARATUS AND IMPRINT SYSTEM

摘要

PROBLEM TO BE SOLVED: To effectively form a coating film on a substrate to improve throughput of substrate processing.

SOLUTION: In a wafer processing apparatus, ultraviolet light is radiated on a surface W1of a wafer W to clean the surface W1(FIG. 18(a)); subsequently, an adherence agent B is coated on the whole area of the surface W1of the wafer W (FIG. 18(b)); the adherence agent B is burned (FIG. 18(c)); subsequently, the adherence agent B is rinsed and an adhesion film BFis deposited on the wafer W (FIG. 18(d)); subsequently, a resist solution R having a photoinitiator is coated on the adhesion film BFof the wafer W (FIG. 18(e)); subsequently, ultraviolet of a predetermined amount of light is radiated on the resist solution R on the wafer W to make the resist solution R be in a semi-cured state such that the resist solution R does not spread and cohere on the wafer W; and a semi-cured resist film RFis deposited on the wafer (FIG. 18(f)).

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