| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device on which semiconductor chips are mounted on both surfaces, which has high connection reliability between the semiconductor chip and leads. <P>SOLUTION: A semiconductor device 100 comprises: a plurality of leads 7 and a second insulation layer which are formed on a first surface of a first insulation layer 1 having the first surface and a second surface; a first semiconductor chip 4 mounted on the first insulation layer 1 side; a second semiconductor chip 5 mounted on the second insulation layer 2 side; first and second openings 6a, 6b formed on the first insulation layer 1; a first lead 7a pressed and bent by the first opening 6a to be bonded to an electrode 4a of the first semiconductor chip 4; and a second lead 7b pressed and bent by the second opening 6b to be bonded to an electrode of the second semiconductor chip 5. Regions on which the semiconductor chips 4, 5 are mounted, respectively, have regions overlapping each other when viewed from a thickness direction of the first insulation layer 1. At least one of the first opening 6a and the second opening 6b is located on the outside the overlapping regions. <P>COPYRIGHT: (C)2013,JPO&INPIT |
