发明名称 |
SYSTEM AND METHOD FOR BONDED CONFIGURATION PAD CONTINUITY CHECK |
摘要 |
<p>A continuity test circuit for a boundary pad includes a pull-up transistor electrically connected between the boundary pad and a first power supply, and a pull-down transistor electrically connected between the boundary pad and a first reference ground potential. A normal output conductor is electrically connected to have a same electrical state as the boundary pad during normal operation. A continuity test output conductor is electrically connected to have a same electrical state as the boundary pad during continuity test operation. Continuity testing control circuitry is defined to control the pull-up transistor, the pull-down transistor, and the normal output conductor during continuity test operation such that an electrical state present on the continuity test output conductor indicates a status of electrical continuity between the boundary pad and either a second power supply or a second reference ground potential to which the boundary pad should be electrically connected.</p> |
申请公布号 |
WO2012118770(A8) |
申请公布日期 |
2012.11.15 |
申请号 |
WO2012US26827 |
申请日期 |
2012.02.27 |
申请人 |
SANDISK TECHNOLOGIES INC.;LIU, BAOJING;GUTTA, ARUNA;SKALA, STEPHEN |
发明人 |
LIU, BAOJING;GUTTA, ARUNA;SKALA, STEPHEN |
分类号 |
G11C29/02;G01R31/04;G01R31/28;G01R31/317 |
主分类号 |
G11C29/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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