发明名称 SYSTEM AND METHOD FOR BONDED CONFIGURATION PAD CONTINUITY CHECK
摘要 <p>A continuity test circuit for a boundary pad includes a pull-up transistor electrically connected between the boundary pad and a first power supply, and a pull-down transistor electrically connected between the boundary pad and a first reference ground potential. A normal output conductor is electrically connected to have a same electrical state as the boundary pad during normal operation. A continuity test output conductor is electrically connected to have a same electrical state as the boundary pad during continuity test operation. Continuity testing control circuitry is defined to control the pull-up transistor, the pull-down transistor, and the normal output conductor during continuity test operation such that an electrical state present on the continuity test output conductor indicates a status of electrical continuity between the boundary pad and either a second power supply or a second reference ground potential to which the boundary pad should be electrically connected.</p>
申请公布号 WO2012118770(A8) 申请公布日期 2012.11.15
申请号 WO2012US26827 申请日期 2012.02.27
申请人 SANDISK TECHNOLOGIES INC.;LIU, BAOJING;GUTTA, ARUNA;SKALA, STEPHEN 发明人 LIU, BAOJING;GUTTA, ARUNA;SKALA, STEPHEN
分类号 G11C29/02;G01R31/04;G01R31/28;G01R31/317 主分类号 G11C29/02
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