| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer electronic component in which a conductor formed on the end face of a laminate can be covered stably, and to provide a manufacturing method therefor. <P>SOLUTION: A multilayer electronic component 10 comprises (a) a laminate 12 on which an insulation layer is laminated, (b) an in-plane connection conductor 15 formed between adjoining insulation layers, (c) an interlayer connection conductor 16 connected with the in-plane connection conductor 15, penetrating the insulation layer in the lamination direction and having a plane 16a formed flush with a surface 12s other than a pair of principal surfaces 12a, 12b on both sides in the lamination direction out of the outer surface of the laminate 12, and (d) a coating layer 13 formed using an insulation material on the surface 12s of the laminate 12 so as to cover the plane 16a of the interlayer connection conductor 16. <P>COPYRIGHT: (C)2013,JPO&INPIT |
