发明名称
摘要 Provided is a transfer mold for forming a component using electroforming, that has good workability and excellent durability. Also provided is a production method for the transfer mold, which includes: a step in which a component-shaped reversed resist pattern, having a desired angle (alpha) for the side wall thereof, is formed upon a metal substrate; a step in which the reversed resist pattern is heat-cured; and a step in which metal is electrodeposited using electroforming at sites other than the reversed resist pattern on the metal substrate, and a resist reinforced section is formed.
申请公布号 JP5073880(B1) 申请公布日期 2012.11.14
申请号 JP20120518646 申请日期 2011.11.17
申请人 发明人
分类号 C25D1/10 主分类号 C25D1/10
代理机构 代理人
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