| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a mounting failure during mounting of a semiconductor device on an interposer. <P>SOLUTION: By providing a projection 20 on an insulating resin 13 of a penetrating electrode 6, it is possible to suppress a percentage that the insulating resin 13 is deteriorated by being decomposed into low molecules by degradation by heat applied when a semiconductor device 1 is mounted on an interposer 16 via a soldering bump 3, and to suppress a mounting failure. <P>COPYRIGHT: (C)2013,JPO&INPIT |
