发明名称 METHOD FOR MOUNTING ELECTRONIC ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for mounting electronic elements which eliminates variations in characteristics of finished devices despite batch processing. <P>SOLUTION: The method for mounting electronic elements 15 includes the steps of: forming the electronic elements having terminal parts for connection to electric circuits 11; preparing a tray 14 having a plurality of spot-faced portions 13 for an array of the electronic elements; arranging the electronic elements in the plurality of spot-faced portions, respectively; preparing a flat substrate 10 having the plurality of electric circuits formed in opposition to the electronic elements arranged in the plurality of spot-faced portions; batch-forming connecting members 12 for securing the electronic elements on mount parts 111 of the electric circuits; and opposing the electronic element terminal parts to the connecting members formed on the mount parts of the electric circuits to batch-secure the plurality of electronic elements arrayed in the tray to the substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012222368(A) 申请公布日期 2012.11.12
申请号 JP20110082358 申请日期 2011.04.04
申请人 CITIZEN FINETECH MIYOTA CO LTD;CITIZEN HOLDINGS CO LTD 发明人 MURATA KAZUO
分类号 H03H3/02;H01L21/60;H01L23/02;H03H9/02 主分类号 H03H3/02
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