发明名称 |
METHOD FOR MOUNTING ELECTRONIC ELEMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for mounting electronic elements which eliminates variations in characteristics of finished devices despite batch processing. <P>SOLUTION: The method for mounting electronic elements 15 includes the steps of: forming the electronic elements having terminal parts for connection to electric circuits 11; preparing a tray 14 having a plurality of spot-faced portions 13 for an array of the electronic elements; arranging the electronic elements in the plurality of spot-faced portions, respectively; preparing a flat substrate 10 having the plurality of electric circuits formed in opposition to the electronic elements arranged in the plurality of spot-faced portions; batch-forming connecting members 12 for securing the electronic elements on mount parts 111 of the electric circuits; and opposing the electronic element terminal parts to the connecting members formed on the mount parts of the electric circuits to batch-secure the plurality of electronic elements arrayed in the tray to the substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012222368(A) |
申请公布日期 |
2012.11.12 |
申请号 |
JP20110082358 |
申请日期 |
2011.04.04 |
申请人 |
CITIZEN FINETECH MIYOTA CO LTD;CITIZEN HOLDINGS CO LTD |
发明人 |
MURATA KAZUO |
分类号 |
H03H3/02;H01L21/60;H01L23/02;H03H9/02 |
主分类号 |
H03H3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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