发明名称 FILM DEPOSITION APPARATUS, AND FILM DEPOSITION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a film deposition apparatus and a film deposition method suitable for film deposition on an inner peripheral surface of a cylindrical body, and capable of suppressing damages caused by &gamma; electrons. <P>SOLUTION: A target holder 9 holds a target 8 as a material of a sputter film, and the relatively negative electric potential is applied thereto. A cylindrical holder 2 holds a cylindrical body 1, and has a conductive part 2b which is constituted so that the relatively positive electric potential may be applied thereto. The conductive part 2b is exposed in an internal space of the cylindrical body 1 while the cylindrical body 1 is held by the cylindrical body holder 2. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012219275(A) 申请公布日期 2012.11.12
申请号 JP20110082711 申请日期 2011.04.04
申请人 FUJITEC INTERNATIONAL INC;MICRO SYSTEM:KK 发明人 KOJIMA MASAYUKI
分类号 C23C14/34;H01L51/50;H05B33/10;H05B33/28 主分类号 C23C14/34
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