| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a resin-sealed package in which terminal surfaces of electronic components are set at a uniform height, and the electronic components are fixed and resin-sealed in a state of being sandwiched between support bodies from top and bottom and thereby to eliminate or reduce occurrence of warp and distortion of the sealing resin, thereby overcoming displacement of the individual electronic components, or the like. <P>SOLUTION: A plurality of electronic components (12, 14, 16) having different heights have a plurality of terminals (12a, 14a, 16a), respectively. Sealing resin (22) seals the electronic components so as to align surfaces of terminals of the electronic components on a predetermined flat surface, and seals the electronic components except for back surfaces thereof on the opposite side of terminal formation surfaces thereof. The sealing resin is also formed flush with the surfaces of the terminals of the electronic components. An insulation resin layer (24) and a wiring layer (26) electrically connected to the terminals of the electronic components are formed on the electronic components and on the sealing resin, thereby constituting a laminate structure. The sealing resin (22) is exposed from a part of side surfaces of the electronic components. <P>COPYRIGHT: (C)2013,JPO&INPIT |
