发明名称 LED PACKAGE STRUCTURE AND LIQUID CRYSTAL DISPLAY
摘要 Provided are an LED package structure (100) and a liquid crystal display. The LED package structure (100) comprises an LED chip (110), a lead frame (120), and a shell (130). The lead frame (120) is disposed in the shell body of the shell (130), and the lead frame (120) comprises a first metal sidewall (121), a second metal sidewall (122) and a bottom surface (123). The first metal sidewall (121) and the second metal sidewall (122) are located at two sides of the bottom surface (123), respectively. The LED chip (110) is disposed at the bottom (123). A surface of the first metal sidewall (121) and a surface of the second metal sidewall (122) are disposed with a plastic layer (131, 132) having a high reflectance, and the plastic layer (131, 132) extends to a direction away from the bottom surface (123) along the surface of the first metal sidewall (121) and the surface of the second metal sidewall (122), and is connected to the shell (130). The LED package structure (100), by disposing the plastic layer (131, 132) having a high reflectance at the metal sidewalls of the lead frame (120), ensures a long path before moisture permeates into the LED package structure (100), and meanwhile reduces the luminous flux loss caused because the LED chip (110) directly irradiates onto a metal support.
申请公布号 WO2012149698(A1) 申请公布日期 2012.11.08
申请号 WO2011CN77013 申请日期 2011.07.09
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.;CHANG, KUANG-YAO;ZHENG, WEIWEI 发明人 CHANG, KUANG-YAO;ZHENG, WEIWEI
分类号 H01L21/56;H01L33/00 主分类号 H01L21/56
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