| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition which has excellent characteristics of concealing a circuit and superior resolution, a dry film, and a printed wiring board using a cured material obtained from the composition or the film. <P>SOLUTION: A curable resin composition contains (A) a carboxyl group-containing resin, (B) a coloring agent, and (C) a filler obtained by burning a hydrated silicate mineral containing aluminum or magnesium. The curable resin composition is preferably black, yellow, orange (amber), blue, green, gray, purple or red. (A) the carboxyl group-containing resin is preferably a carboxyl group-containing resin having a photopolymerizable unsaturated double bond. <P>COPYRIGHT: (C)2013,JPO&INPIT |
