| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Sn plating material that can suppress the occurrence of Sn powder by partially exposing a Cu-Sn alloy layer in a reflow Sn plating layer on the surface of a copper or copper alloy strip. <P>SOLUTION: The Sn plating material 10 has a Sn plating layer 6 for which reflow processing has been carried out on the surface of a copper or copper alloy strip 2. The area ratio of a Cu-Sn alloy layer 4a exposed on the outermost surface is 0.5-4%, and when viewed from the outermost surface, the number of exposed spots for the Cu-Sn alloy layer is 100-900 per 0.033 mm<SP POS="POST">2</SP>. <P>COPYRIGHT: (C)2013,JPO&INPIT |
