<p>The semiconductor module (1) has an electrically insulative housing in which a cooling device (13) with a cooling liquid inlet (131) and a cooling liquid outlet (133), and power electronic subsystems (12) are arranged. The cooling device has cooling chambers (132) in which the power-electronic subsystems is in thermal contact with the cooling fluid. An independent claim is included for power electronic device.</p>
申请公布号
EP2521431(A2)
申请公布日期
2012.11.07
申请号
EP20120158227
申请日期
2012.03.06
申请人
SEMIKRON ELEKTRONIK GMBH & CO. KG
发明人
BECKEDAHL, PETER;BOGEN, INGO;EHLER, RALF;DR. KOBOLLA, HARALD;DR. STOCKMEIER, THOMAS