| 摘要 |
A diamond wire saw device including a diamond sawing wire. At least two diamond sawing wires are arranged in the front and back of a cutting working surface along a cutting feed direction, or at least two groups of the diamond sawing wires are arranged in the front and back of more than one parallel cutting working surface. The diamond sawing wires in the same group are parallel to one another to form a layer of cutting mesh surface. The diameter of a latter diamond sawing wire or a latter group of diamond sawing wires is equal to or greater than that of a former diamond sawing wire or a former group of diamond sawing wires. |
