| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer substrate with improved adhesiveness of a surface pad layer. <P>SOLUTION: A structure of a surface treatment layer of a multilayer substrate includes a pad layer 301, at least one coating metal layer 302, 303, and a solder mask layer 304. The pad layer is buried in a dielectric layer, the at least one coating metal layer coats the pad layer, and the solder mask layer has an aperture for exposing the at least one coating metal layer. In this invention, the coating metal layer is formed on a surface of the pad layer first and then the solder mask layer is formed. Thereafter, the solder mask layer is opened to the position of the coating metal layer to expose the coating metal layer. Since the pad layer is buried in the dielectric layer, adhesive force between the pad layer and the dielectric layer is increased. Simultaneously, since the solder mask layer covers a portion of the coating metal layer, contact of solder of a tin material or the like and the pad layer during packaging is prevented. <P>COPYRIGHT: (C)2013,JPO&INPIT |
