| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection which shows a high reflectance to visible light to near-ultraviolet light after hardening, has good thermal deterioration-resistance and good tablet moldability, and is less prone to forming a flash at the time of transfer molding, a method of manufacturing the same, and a substrate to mount an optical semiconductor device on and an optical semiconductor device, both using the resin composition. <P>SOLUTION: The thermosetting resin composition for light reflection comprises a thermosetting component and a white pigment. The length of flash formed when the thermosetting resin composition is transfer-molded under the conditions of a molding temperature of 100-200°C, a molding pressure of not more than 20 MPa, and a mold time of 60-120 seconds is 5 mm or smaller, and the light reflection coefficient at a wavelength of 350-800 nm after thermal hardening is 80% or larger. The substrate to mount an optical semiconductor device on, and the optical semiconductor device are formed by using the thermosetting resin composition for light reflection. <P>COPYRIGHT: (C)2013,JPO&INPIT |
