| 摘要 |
<p>The invention describes an improved process for epitaxially electrodepositing a nickel, cobalt and boron alloy on a metallic or non-metallic substrate suitably prepared for electrodeposition, said process comprising a subprocess of preparing the surface, which makes it possible to electrodeposit said nickel, cobalt and boron alloy on solid or hollow substrates with bores, hollows or cavities, said alloy even being deposited inside said bores, cavities or inner surfaces of the geometry of the substrate, a subprocess of electrodeposition, and a control system. This improved process enables efficient epitaxial deposition without the original roughness, geometries or soiling of the substrate being important.</p> |
