MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which improves the connection reliability when different kinds of semiconductor chips are laminated.

SOLUTION: A manufacturing method of a semiconductor device includes: a step where a chip lamination body 3A formed by laminating multiple semiconductor chips 11a to 11e is produced while joining connection terminals 12a, 12b of multiple semiconductor chips 11a to 11b to each other through thermocompression bonding; and a step where the chip lamination body 3A is sealed with an underfill material 4 by thermally hardening the underfill material 4 after filling the underfill material 4 into clearances of the multiple semiconductor chips 11a to 11e. A temperature of the chip lamination body 3A is maintained at a predetermined temperature or higher between the step where the chip lamination body 3A is produced and the step where the chip lamination body 3A is sealed by the underfill material 4.

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