| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition from which a transparent cured product can be formed, the product sufficiently satisfying a required level to be used for photo-semiconductors, in any properties of resistance against yellowing by heat, light resistance, scratch resistance and adhesiveness. <P>SOLUTION: The thermosetting resin composition contains organopolysiloxane including a specific methacryloyloxy group-containing cyclic siloxane compound and a specific methacryloyloxy group-containing cyclic siloxane in which adjoining silicon atoms are substituted with a cyclic substituent containing siloxane, in which a molar fraction of hydrosilyl groups included in organosiloxane including the above two compounds is 0.020 or less. <P>COPYRIGHT: (C)2013,JPO&INPIT |
