发明名称 |
Semiconductor connection component |
摘要 |
There is a need for providing a technology capable of decreasing on-resistance of a power transistor in a semiconductor device that integrates the power transistor and a control integrated circuit into a single semiconductor chip. There is another need for providing a technology capable of reducing a chip size of a semiconductor device. A semiconductor chip includes a power transistor formation region to form a power transistor, a logic circuit formation region to form a logic circuit, and an analog circuit formation region to form an analog circuit. A pad is formed in the power transistor formation region. The pad and a lead are connected through a clip whose cross section is larger than that of a wire. On the other hand, a bonding pad is connected through the wire. |
申请公布号 |
US8298859(B2) |
申请公布日期 |
2012.10.30 |
申请号 |
US201113035273 |
申请日期 |
2011.02.25 |
申请人 |
KOIKE NOBUYA;MATSUSHITA TSUKASA;SATO HIROSHI;OKAWA KEIICHI;NISHIKIZAWA ATSUSHI;RENESAS ELECTRONICS CORPORATION |
发明人 |
KOIKE NOBUYA;MATSUSHITA TSUKASA;SATO HIROSHI;OKAWA KEIICHI;NISHIKIZAWA ATSUSHI |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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