HEAT RADIATING PRINTED CIRCUIT BOARD AND CHASSIS ASSEMBLY HAVING THE SAME

摘要

The present invention relates to a heat radiating printed circuit board (PCB) and a chassis assembly having the same, the heat-radiating PCB characterized by: a circuit pattern unit mounted with a light emitting diode; and one or more mounting units bent from the circuit pattern unit to be fixed at a chassis providing a lightguide path of a backlight unit, where one of the mounting units is mounted to the chassis via a thermal interface material to maximize the heat radiating characteristic of the PCB and to reduce the manufacturing cost.