| 摘要 |
<P>PROBLEM TO BE SOLVED: To ensure solderability in a semiconductor without setting the conductor of a ceramic substrate to be a two-layer structure having a different composition of glass components in a method of mounting a semiconductor chip, where the semiconductor chip is soldered onto the conductor of a ceramic substrate. <P>SOLUTION: In the method of mounting a semiconductor chip, solder 30 is supplied onto the conductor 21 provided on the ceramic substrate 20 for mounting the semiconductor chip 10 via the solder 30, thus joining the conductor 21 to the semiconductor chip 10. In this case, the solder 30 is supplied onto the conductor 21 after the surface of the conductor 21 is polished by jet scrub, or the like, thus removing glass constituents existing on the surface of the conductor 21. <P>COPYRIGHT: (C)2008,JPO&INPIT |
