发明名称 Bondwireless Power Module with Three-Dimensional Current Routing
摘要 According to an exemplary embodiment, a bondwireless power module includes a common output pad coupling an emitter/anode node of a high side device to a collector/cathode node of a low side device. The bondwireless power module also includes a high side conductive clip connecting a collector of the high side device to a cathode of the high side device, and causing current to traverse through the high side conductive clip to another high side conductive clip in another power module. The bondwireless power module further includes a low side conductive clip connecting an emitter of the low side device to an anode of the low side device, and causing current to traverse through the low side conductive clip to another low side conductive clip in the another power module. The bondwireless power module can be a motor drive inverter module.
申请公布号 EP2515332(A2) 申请公布日期 2012.10.24
申请号 EP20120159773 申请日期 2012.03.15
申请人 INTERNATIONAL RECTIFIER CORPORATION 发明人 HAUENSTEIN, HENNING M.;GORGERINO, ANDREA
分类号 H01L23/498 主分类号 H01L23/498
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