SLURRY COMPOSITION FOR COPPER CHEMICAL MECHANICAL POLISHING

摘要

PURPOSE: A slurry composition is provided to have excellent dispersion stability and polishing ratio in chemical mechanical polishing process, especially in copper CMP, and to improve polishing rate, polishing selectivity ratio, etc. CONSTITUTION: A slurry composition comprises: abrasive selected from a group consisting of ceria, alumina, silica, titania and zirconia and of which solid content is 0.5-10 weight%; a complexing agent having a carboxy group and amino group at the same time, and a corrosion inhibitor comprising an azole group. The complexing agent comprises one or more selected from serine, arginine, glutamine, and salts thereof and has a pH of 6-8. The corrosion inhibitor comprises 5-aminotetrazole or benzotriazoles.